Description

Solder Wave Masking Discs are made of a 4 mil thick creped back paper with rubber adhesive. They can withstand 5 to 8 seconds of solder wave exposure up to 500 degrees F (260 degrees C) without adhesive transfer. They are ideal for use in wave soldering process to mask sensitive components and high temperature paint operations. These masking discs can be removed cleanly without leaving any residue.

Custom sizes are available upon request.

Additional information